Apple is already designing the chips that will use TSMC’s next-generation 2-nanometer fabrication process, according to information allegedly sourced from an Apple employee on LinkedIn.
Originally captured by Korean website gamma0burst and shared on X (Twitter) by the leaker Revegnus (@Tech_Reve), the information appears in a heavily redacted slide said to list the employee’s work on past and current projects at Apple.
A non-redacted part of the slide reads “TS5nm, TS3nm, working on TS2nm,” terms believed to reference the different fabrication processes Apple has chosen for past, current, and future chips. Terms like “3nm” and “2nm” refer to the specific architecture and design rules TSMC is using for a family of chips. Decreases in node size correspond to a smaller transistor size, so more transistors can fit on a processor, leading to boosts in speed and more efficient power consumption.
Read more at MacRumors.com