Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and enhance the performance of its data centers and future AI tools that rely on the cloud.
Developed by TSMC and unveiled in 2018, SoIC (System on Integrated Chip) technology allows for the stacking of chips in a three-dimensional structure, providing better electrical performance and thermal management compared to traditional two-dimensional chip designs.
According to the Economic Daily, Apple has expanded its cooperation with TSMC on a next-generation hybrid SoIC package that additionally combines thermoplastic carbon fiber composite molding technology. The package is said to be in a small trial production phase, with the intention of mass producing the chips in 2025 and 2026 for new Macs and AI cloud servers.
Read more at MacRumors.com