Apple chipmaking partner TSMC says it will be ready to move its 3nm chip process to volume production in the second half of this year, putting it on track to supply Apple with the next-generation technology in 2023 (via DigiTimes).
“We expect the ramp of N3 to be driven by both HPC [high performance computing] and smartphone applications,” said Wei during an April 14 earnings conference call. “We continue to see a high level of customer engagement at N3 and expect more new tape-outs for N3 for the first year as compared with N5 and N7.”
TSMC is expected to initially process 30,000-35,000 wafers manufactured using 3nm process technology monthly, according to industry sources cited by DigiTimes.
Read more at MacRumors.com