Apple today announced the M1 Ultra chip, the third iteration to the M1 family, and it represents the next “breakthrough” for Apple Silicon.
M1 Ultra consists of two M1 Max chips connected with die-to-die technology called “UltraFusion.” The new highest-end chip of Apple Silicon features 114 billion transistors, with higher support for bandwidth memory at 800GB/s.
Read more at MacRumors.com